Heidelberg Instruments

• Maximum exposure area: up to 400 x 400 mm²
• Maximum substrate size: 17″ x 17″
• Professional Grayscale Mode
• Multiple Write Modes
• Minimum feature size down to 0.5 µm
• Maximum exposure speed (at 1.3 µm feature size): 370 mm²/ minute
• Address grid down to 5 nm
• Modular configuration concept to fit customer application
• Realtime autofocus
• Stage map correction
• Camera system for measurement and inspection
• Automatic loading system
• Customer specific laser
• Multiple data input formats (DXF, CIF, GDSII, Gerber, STL, BMP)

• Maximum exposure area: 200 x 200 mm²
• Maximum substrate size: 9″ x 9″
• Multiple Write Modes
• Minimum feature size: down to 300 nm
• Maximum write speed (at 4 µm feature size): 2000 mm²/min
• Address grid down to 5 nm
• Grayscale exposure mode with up to 1000 gray levels
• Vector and Raster scan exposure mode
• Multiple data input formats
• Front- and backside alignment
• Climate chamber
• Two choices of laser wavelength (405 nm or 375 nm)
• Real-time autofocus system
• Scripting capability
• Integrated camera system for measurement and inspection

• Maximum exposure area: 300 mm x 300 mm
• Minimum feature size: 1.5 μm
• Minimum lines and spaces: 2 µm
• Maximum write speed: 5000 mm²/min (at 405 nm, with one module)
• Real-time autofocus
• Overview camera for fast alignment and inspection
• Front- and backside alignment
• Temperature-controlled environmental chamber
• Exposure wavelengths: 405 nm and / or 375 nm

• Substrate size: from 5 mm to 5”
• Minimum feature size: down to 0.6 µm
• Maximum write speed (at 4 µm resolution): 200 mm²/min
• Real-time autofocus system
• Frontside alignment
• Easy-to-use operating software
• 2 available optical setups
• Choice of exposure Module: Raster and/or Vector scan
• Variable resolution
• Draw Mode
• Wavelengths (Raster Scan): 390 nm or 365 nm exposure wavelength
• Wavelengths (Vector Scan): 405 nm and/or 375 nm
• Overview camera for alignment and inspection

• Minimum substrate size: 3 mm x 3 mm
• Maximum exposure area: 6” x 6” (optional 8”x 8”)
• Minimum structure size down to 0.6 μm
• Maximum write speed: 1400 mm²/min at 1 μm feature size
• Real-time autofocus
• Overview camera for fast alignment and inspection
• Front- and backside alignment
• Temperature-controlled environmental chamber
• Exposure wavelengths: 405 nm and / or 375 nm
• Draw Mode for CAD-less exposure
• Standard Grayscale Exposure Mode
• High-Aspect Ratio Mode
• Easy-to-use operating software

Lithography systems can accommodate substrates of arbitrary shapes with lateral dimensions of up to 1400 x 1400 mm²

Deep UV lithography systems with a 244 nm laser source, which can expose these resists and write isolated structures down to 200 nm and lines and spaces with a period of 500 nm. Other DUV light sources are available on demand.

• Applications for implementation of electronic systems
• Non-planar surfaces
• Imaging sensors
• Artificial vision
• Integrated micro-optics

• Substrates up to 6“ x 6“
• Structures down to 0.6 μm
• Address grid down to 20 nm
• Basic gray scale exposure mode
• Real time auto focus system
• Standard or UV diode laser source
• Vector and raster exposure mode
• Exchangeable write modes
• Camera system for alignment