Heidelberg Instruments

The MLA150 has been specifically designed for easy operation and includes all our know-how on developing maskless lithography systems that we have gathered in the past 30 years. It offers all the capabilities that are required for single layer and multi-layer applications and because the MLA150 exposures are always non-contact it will even overcome some of the limitations of photomask based exposure technologies.

The MLA100 is the perfect lithography solution for many R&D applications. The optical system is designed to write structures down to 1 μm at a speed of 50 mm²/min directly into photoresist, without the need for a photomask. The elimination of photomasks from the lithographic process will increase the flexibility and significantly shorten the prototyping or manufacturing cycle.

Lithography systems can accommodate substrates of arbitrary shapes with lateral dimensions of up to 1400 x 1400 mm²

Deep UV lithography systems with a 244 nm laser source, which can expose these resists and write isolated structures down to 200 nm and lines and spaces with a period of 500 nm. Other DUV light sources are available on demand.

• Applications for implementation of electronic systems
• Non-planar surfaces
• Imaging sensors
• Artificial vision
• Integrated micro-optics

• Substrates up to 200 x 200 mm²
• Structures down to 0.6 µm
• Address grid down to 10 nm
• Multiple write modes
• Vector and Raster exposure mode
• Multiple data input formats

• Substrates up to 6“ x 6“
• Structures down to 0.6 μm
• Address grid down to 20 nm
• Basic gray scale exposure mode
• Real time auto focus system
• Standard or UV diode laser source
• Vector and raster exposure mode
• Exchangeable write modes
• Camera system for alignment