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Nanosurf is the market leader for custom developed systems for large and heavy samples. Over the past years our team has built a substantial knowledge base developing these custom stages for various customers.
Utilizing this vast body of knowledge, we have now developed a standard product for large samples up to 300 mm or heavy samples up to 45 kg. The Alphacen 300 reduces the price and the delivery time compared to a custom system.
The Alphacen 300 includes powerful automation software that allows the user to preselect the locations of interest, either on an optical image or a stage map, and let the system collect the images with no user intervention.
Most large sample AFMs are capable of handling planar samples up to 200 mm, typically geared toward analysis of semiconductor wafers. However, one of the limitations of these systems is the sample weight that they can handle.
Alphacen 300 addresses the need for a standard AFM capable of imaging large and heavy samples with a weight limit of up to 45 kg. The Z-stage travel of 50 mm also allows for imaging of samples that are not thin silicon wafer.
Large, heavy samples are quite commonplace in the optical industry, e.g. in the production of large lenses and semiconductor industry, e.g. assembled cassettes or completed products.
This overview shows which modes the instrument is capable of. Some modes may require additional components or software options. For details, please contact us.
Standard imaging modes
Thermal imaging modes
Other measurement modes
Spectra Research Corporation (SRC) offers a range of innovative high-quality scientific products and laboratory services to industrial and scientific markets throughout Canada.
|Scan head type||Tip scanner|
|Max. scan range (XY)||100 µm(1)|
|Max. Z-range||10 µm(1)|
|XY linearity mean error||< 0.1%|
|XY flatness at max. scan range||typ. 5 nm|
|Z-sensor noise-level (RMS)||typ. 150 pm / max. 200 pm|
|Z-measurement noise level
(RMS, static mode in air)
|typ. 100 pm / max. 200 pm|
|Z-sensor noise level
(RMS, dynamic mode in air)
|typ. 25 pm / max. 35 pm|
|Optical detection light source||850 nm low coherence SLD|
|DC Detector noise||< 10 pm RMS (0.1 Hz to 1 kHz)|
|AC Detector noise||< 60 fm Hz-1/2 above 100 kHz|
|Detector bandwidth||DC to 4 MHz|
|(1) Manufacturing tolerances ± 10%|
|Top view field of view||5 MP, 1.5 mm x 1.1 mm|
|Side view field of view||5 MP, 3.2 mm x 3.2 mm|
|Max. sample size||300 mm x 300 mm x 45 mm|
|Max. sample weight||40 kg|
|Vacuum chuck for||4’’ / 6’’ / 8’’ / 12’’ wafers|
|Motorized XY travel range||300 mm x 300 mm|
|Motorized approach range||50 mm|
|System dimensions||1008 mm x 1887 mm x 1208 mm (fits through 800 mm door prior to assembling the acoustic enclosure)|
|System weight||833 kg|
|Stage XY resolution||< 1 µm|
|Unilateral repositioning accuracy||2 µm|
|Acoustic isolation||~30 dB above 250 Hz|
|Vibration isolation||Active vibration isolation|
|High resolution outputs (DAC)||12x 28 bit, 1 MHz/sampling; thereof 4x user DAC, ±10V/3dB@200kHz|
|Fast outputs (DAC)||4x 16 bit, 100 MHz/sampling; thereof 1x user DAC, ±1V/3dB@10MHz|
|High resolution inputs (ADC)||10x 20 bit, 1 MHz/sampling; thereof 4x user ADC, ±10V/3dB@200kHz|
|Fast inputs (ADC)||3x 16 bit, 100 MHz/sampling; thereof 1x user ADC, ±1V/3dB@10MHz|
|Signal analyzer||2 signal analyzer function blocks that can be configured as dual channel lock-in|
|FPGA module and embedded processor||System-on-chip module with low-latency FPGA signal processing at 100MHz and dual-core ARM processor, 2GB RAM, 1.5GHz clock|
|Scan control||28Bit X/Y/Z-DAC with ±10V/3dB@200kHz|
|Detector inputs||Deflection/lateral signals each 16 bit/3dB@10MHz and 28 bit/3dB@200kHz|
|Digital sync, Spike-Guard||2-bit line/frame sync out 5 V/TTL galvanically isolated, Spike-Guard input|
|Clock sync||10MHz/3V clock input to synchronize data acquisition and processing|
|Communication to PC||Gigabit Ethernet, galvanically isolated|
|Width||min. 20 μm|
|Length||min. 40 μm|
|Reflective coating||Reflective coating recommended|
|Liquid measurements||Yes, with gold coating|
|Alignment grooves||Required by default
Special cantilever holders without alignment grooves are available
|Cantilever shape||Single rectangular cantilevers and multilever cantilevers (depending on scan head version and cantilever holder)|
|Chip thickness||300 μm, 500 μm or 600 μm depending on cantilever holder|