Author: Mihir Mehta

Ceramic 3D Printing & Advanced Filament Extrusion Tour in Canada

Join SRC, 3DCERAM, and 3devo for a free on-site event series featuring expert talks, live instrument demonstrations, and application discussions on ceramic additive manufacturing, filament development, and advanced materials workflows.

Time: 9:00 AM ET – 1:45 PM ET

See additive manufacturing workflows beyond slides:

This tour is designed for researchers, engineers, and technical teams who want to move beyond product overviews and understand how ceramic 3D printing and filament extrusion fit into real development workflows. The program connects scientific challenges with process capability, materials behavior, instrument design, and practical application discussions led by SRC and supplier specialists.

Tour Details:

One event series, three Canadian stops. Each session includes technical talks, live demos, networking, and direct conversations with SRC, 3DCERAM, and 3devo. Replace the placeholder registration links below with your final event URLs.

Event Agenda:

Each stop follows the same half-day format, combining expert presentations with networking and hands-on technology exposure.

Featured Presentations:

Two supplier-led sessions designed for technical audiences evaluating materials, process capability, and additive manufacturing workflow fit.

Rouslan Svintsitski | Area Sales Manager, 3DCERAM Sinto SAS	José Rui Capitão | Application Specialist, 3devo B.V.
Rouslan Svintsitski brings more than 30 years of experience in ceramic processes and technologies, spanning technical ceramics, extrusion, and international business development in ceramic 3D printing. His recent work has focused on advanced ceramic materials and additive manufacturing workflows for demanding applications in investment casting, aerospace, and defense. Ceramic 3D Printing with Multi-Additive Technology Printer: Capabilities, Materials and Applications This session explores extrusion-based ceramic additive manufacturing with a focus on fused filament fabrication for advanced ceramics. It examines why extrusion-based approaches can be especially relevant for dark ceramics such as silicon carbide, where optical limitations can make other ceramic AM routes more challenging. Ceramic FFF workflow from feedstock to printed green part Debinding and sintering pathway Material opportunities including SiC and other advanced ceramics Part quality, densification, and performance considerations Applications where high-quality ceramic AM parts remain difficult to source	José supports customers worldwide in material selection, material research, and recycling-oriented workflows using advanced extrusion technologies. He combines technical engineering expertise with customer-focused problem solving in material innovation environments. Advanced Filament Extrusion: Turning Materials into Filament through Tools, Theory, and Innovation This session provides a structured look at how raw materials are transformed into high-quality filament through controlled extrusion workflows. It covers key equipment, extrusion theory, material behavior, process parameters, and strategies for new material development. Material preparation and feedstock considerations Core filament extrusion theory Critical process parameters and material behavior Structured approaches to new material development Technical comparison of filament-making capabilities across applications

Live Instrument Demonstrations:

The tour is designed to bring prospects into the room with the equipment. Attendees will see the instruments, discuss workflow details, and connect process capability to their own application requirements.

3DCERAM M.A.T. (Multi Additive Technology) See how extrusion-based additive manufacturing can support ceramic and metal part development using a platform designed to combine multiple deposition methods with integrated green machining. The session will center on capabilities relevant to complex ceramic geometries, dark ceramic processing, and post-print workflow considerations. Explore ceramic 3D printing routes for advanced materials and complex parts Understand workflow differences between filament, pellet, and paste-based approaches Evaluate how green machining may improve part detail and surface finish Discuss technical fit for research and industrial development workflows

3devo Filament Maker TWO See a controlled filament extrusion workflow designed for material validation, process development, and repeatable filament production. This demonstration is especially relevant for teams developing new materials, refining process settings, or connecting filament performance to downstream additive manufacturing workflows. Assess how filament development fits into material innovation workflows Discuss parameter control, consistency, and repeatability Explore material development and recycling-oriented use cases Connect feedstock development with additive manufacturing readiness

Who Should Attend:

This event is designed for Canadian technical audiences working across material development, process engineering, and additive manufacturing.

Date: June 20, 2025
Time: 10:00 AM Onwards
Venue: McGill University – Room 103, Rutherford Physics Building
Address: 3600 University Street, Montreal, Quebec, Canada H3A 2T8

Event Overview:

Spectra Research Corporation (SRC) in collaboration with Heidelberg Instruments invites you to an exclusive seminar and hands-on workshop focused on cutting-edge nanofabrication techniques and characterization methods for advanced nano and 2D material devices. Join industry-leading experts and researchers at McGill University to explore next-generation NanoFrazor capabilities and advanced AFM characterization methods.

Agenda

Morning Session:

• 10:00 AM – 10:15 AM: Facility Introduction by Dr. Zhao Lu
• 10:15 AM – 10:30 AM: SRC and Vendor Introduction by Serge Dandache (SRC)
• 10:30 AM – 11:15 AM: Presentation by Dr. Nicholas Hendricks (Heidelberg Instruments)
  Topic: Fabrication of Advanced Nano and 2D Material Devices – Utilizing Next Generation NanoFrazor Capabilities
• 11:15 AM – 11:30 AM: Coffee break with some Donuts!!
• 11:30 AM – 12:00 PM: Presentation by Sean Chen (McGill University)
  Topic: Probing the Persistent Photoresponse in WS₂ using Kelvin Probe Force Microscopy
• 12:00 PM – 1:00 PM: Lunch Break – Pizzas and Drinks

Afternoon Workshop Sessions (Cleanroom Demo):

• Session 1: 1:00 PM (Max 5 participants)
• Session 2: 1:45 PM (Max 5 participants)

Note: Each workshop session is limited to a maximum of 5 participants. Please register in advance and indicate your preferred slot (First come, first served basis).

Keynote Speakers

Dr. Nicholas Hendricks
Innovation Manager, Heidelberg Instruments Nano, Zürich, Switzerland

Nicholas specializes in next-generation nanolithography, with extensive experience in polymer science and advanced fabrication techniques. His expertise includes direct-write lithography methods for nanoelectronics, photonics, molecular sensing, and quantum computing applications.

Talk Highlights:

• Overview of Thermal Scanning Probe Lithography (t-SPL) with Heidelberg’s NanoFrazor for precise fabrication of nano and 2D material devices
• Benefits of NanoFrazor for direct-write nanolithography without charged particle damage
• Application examples including nanowires, quantum devices, and 2D material electronics
• Latest advancements: parallelized large-area patterning and automated nanofabrication

Sean Chen
Master’s Student, Department of Physics, McGill University

Working under Prof. Peter Grutter, Sean focuses on electrical properties of two-dimensional materials and optoelectronic devices, employing atomic force microscopy techniques such as Kelvin Probe Force Microscopy to study persistent photoconductivity in transition metal dichalcogenides.

Talk Highlights:

• Understanding persistent photoconductivity in WS₂ flakes using Kelvin Probe Force Microscopy
• Time-resolved studies of surface potential and photocurrent
• Investigations on the effects of illumination intensity, wavelength, doping, and flake thickness

Hands-On Demo: NanoFrazor – Thermal Scanning Probe Lithography

Experience a live demonstration of Heidelberg’s NanoFrazor Thermal Scanning Probe Lithography System, showcasing its unique capabilities including:

• High-resolution, markerless overlay and sub-2 nm vertical precision
• Real-time in-situ imaging
• Versatile modular platform suitable for quantum devices, photonics, biotechnology, and MEMS
• Integrated Direct Laser Sublimation (DLS) for high-speed micro patterning

Who Should Attend?

• Researchers and professionals in nanoelectronics, semiconductor fabrication, and materials science
• Graduate students in physics, chemistry, and engineering
• Industry professionals involved in advanced electronic device fabrication and characterization

Register Today!

Don’t miss this opportunity to deepen your knowledge, network with experts, and gain practical insights into cutting-edge nano and 2D material research and fabrication techniques.

For inquiries or workshop registration, please contact us at:
📧 [email protected] | 📞 905-890-0555

We look forward to seeing you at McGill University!

Times:

Option 1: 10 am CEST (More suitable for Europe and Asia)
Option 2: 6 pm CEST (More suitable for North and South America) 

While the semiconductor industry continues to push the limits of device performance and miniaturization, 3D metrology remains essential for achieving consistent yield, reliable quality, and faster time-to-market. 

In this webinar, discover how 3D optical metrology meets the challenges posed by both front-end and back-end semiconductor manufacturing. You’ll learn about cutting-edge automation for in-line inspection, best practices for advanced packaging and heterogeneous integration evaluation, and real-world applications from wafer-level testing to final device verification. 

Join us to see how Sensofar’s metrology solutions can help keep you ahead in the rapidly evolving semiconductor landscape. 

Key topics 

1. Critical role of 3D metrology for semiconductor manufacturing Gain a clear understanding of the key challenges in today’s shrinking geometries and tight tolerances. Discover how non-contact 3D surface measurements optimize process control, reduce defects, and increase yield in both front-end and back-end semiconductor production. 
2. Leveraging Automation for High-Volume/High-Yield Environments Learn how automated acquisition and analysis streamline inspection steps, 

1. -making in high-throughput fabs. Discover how integrable systems ensure consistent quality and cost-effectiveness at every semiconductor manufacturing step. 
2. Tackling next-gen chips: advanced packaging and heterogeneous integration Dive into the specific metrology needs of emerging packaging technologies, like 2.5D and 3D packaging, wafer and panel-level packaging, and co-packaged optics. Understand how 3D optical metrology addresses critical inspection requirements to ensure product reliability in the face of increasingly complex integration. 
3. Real-world Applications Across the Semiconductor Supply Chain See how semiconductor leaders integrate 3D measurement at wafer-level testing, post-bond inspection, and final device verification. Uncover proven strategies for catching defects early, reducing scrap, and maintaining quality throughout multi-site supply chains. 

Register Here

In today’s fast-paced industries, understanding surface texture is key to improving product quality and manufacturing efficiency. This webinar will guide you through the fundamentals of surface texture characterization and provide practical tools to enhance your results.

What You Will Learn:

1. Surface Texture Fundamentals:
   Understand the core concepts of surface finish, roughness, texture, and topography. Discover why mastering surface texture is crucial for ensuring high product standards and optimizing research and industrial processes.
2. Characterization Techniques:
   Learn the step-by-step process of evaluating surface texture, from selecting the right measurement techniques to analyzing and reporting accurate results. Gain insights on choosing the most suitable parameters for your specific application.
3. Standards Update:
   Stay informed about the latest ISO standards, including updates to ISO 25178 and the new ISO 21920 for 2D measurements. Learn how these changes impact surface texture evaluation and how to ensure compliance with industry standards.

Speaker:

David Páez

BSc in Engineering Physics, MSc in Nanoscience and Nanotechnology
Senior Product Specialist at Sensofar Metrology

David has a strong background in optical metrology and has spent years helping customers optimize their surface texture measurements. With hands-on experience in Sensofar’s demo room, he excels at showcasing how to fully utilize Sensofar’s metrology systems to drive accurate results and improve manufacturing processes.

Registration:

Session 1: 10 AM CET (Asia & Europe)
Session 2: 6 PM CET (North America)

Join us for this insightful webinar to gain a deeper understanding of surface texture characterization, and learn how to apply these techniques in your industry.

For more information or to speak with our team about how Sensofar’s metrology systems can benefit your work, Contact Us today!

Date and Time:

📅 October 22nd, 2024
🕘 Session 1: 09:00 AM – 10:00 AM CET
🕓 Session 2: 04:00 PM – 05:00 PM CET

Overview:

Wettability plays a crucial role in determining how solid materials interact with liquids, typically assessed through contact angle measurements. While measuring contact angles is straightforward for large samples, fibers and thin objects require specialized techniques.

Join us for this insightful webinar, where we will explore:

• Key methods for measuring the contact angle of fibers and thin objects
• Pros and cons of each measurement technique
• Real-world applications and case studies to highlight the best methods for different industries

Speaker Details:

Susanna Lauren, Marketing Director of Attension, KSV NIMA
With over 10 years of experience at Biolin Scientific and a PhD in surface wettability and analysis, Susanna brings a wealth of knowledge to the topic. Her research has paved the way for innovative techniques in biomolecule separation using microfabricated polymer chips.

Don’t miss this opportunity to gain valuable insights into fiber wettability and its critical applications!