Photolithography is a standard process step in semiconductor device fabrication. Heidelberg Instruments Maskless Lithography tools cover a wide range of Header_Semi-2lithography applications in the Front-End-Of-Line as well as in the Back-End-Of-Line semiconductor production. Direct patterning of wafers can be performed by all systems from the product lineup. The tools offer advanced alignment capabilities to build up multi-layer devices. The µPG series are used for rapid prototyping of all kinds of new electronic components for example rolled-up electronic devices. Applications, which require smaller features, higher speed and better exposure performance can be created utilizing the DWL and VPG series of direct write lithography systems. Semiconductor

High-end photomasks for steppers and mask aligners is one of the preferred applications for VPG and DWL systems. They fulfill all demands for advanced photomask fabrication and represent the standard photomask production solution in the market. Semiconductor


The μPG 101 is an extremely economical and easy to use micro pattern generator for direct writing applications and low volume mask making. The system can be used for applications such as MEMS, Bio MEMS, Integrated Optics, Micro Fluidics or any other application that requires high precision, high-resolution microstructures.

The μPG 101 offers a very small footprint of only 60 x 75 cm² featuring a compact design with all electronic components integrated into the system. A personal computer is used for system control. The Windows® based control software makes it easy for users to convert the designs, perform a manual or automatic alignment and start the exposure.

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Structure: Star<br/>Resist: SU-8<br/>Thickness: 50 µm

Courtesy of N. Terrier (INL) and R. Fulcrand (ILM), University of Lyon

Structure: μFluidic Mixer<br/>Resist: SU-8<br/>Thickness: 30 μm

Courtesy of N. Terrier (INL) and R. Fulcrand (ILM), University of Lyon