Micro-lithography Systems

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Heidelberg Instruments Heidelberg DWL 2000 GS / DWL 4000 GS
High-Precision Grayscale Lithography Systems for Micro-Optics & More
- Minimum Feature Size: 500 nm
- Write Modes: Five options with variable write speeds and resolutions
- Max Substrate Size: DWL 2000 GS: 200 x 200 mm², DWL 4000 GS: 400 x 400 mm²
- Exposure Speed: Up to 1000 mm²/min in grayscale mode
- Automation Ready: Loading system, carrier station, pre-aligner & scanner options available
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Heidelberg Instruments Heidelberg DWL 66+ High-Resolution Laser Lithography
Ultimate Laser Lithography Tool for Research & Prototyping
- High-Resolution Patterning: Minimum feature size down to 300 nm, outperforming traditional optical lithography.
- Grayscale Lithography: Supports up to 1024 gray levels for 2.5D topographies (e.g., diffractive optics, micro-optics, holograms).
- Precision Alignment:
  
  Frontside Alignment Accuracy: 250 nm
  
  Backside Alignment Accuracy (Optional): 1000 nm
  
  2nd Layer Overlay Accuracy: 350 nm (with High-Accuracy Option)
- Versatile Substrate Compatibility: Supports substrates from 5 mm to 230 mm, with thickness up to 12 mm.
- Flexible Laser Options: Choose between 405 nm (broadband resists) and 375 nm (SU-8 & i-line resists).
- Automated Loading System (Optional): Enables high-precision wafer handling, supporting masks up to 7” and wafers up to 8”.
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Heidelberg Instruments Heidelberg MLA 150 Maskless Lithography
High-Speed Maskless Lithography for R&D & Rapid Prototyping
- Fastest Maskless Lithography System: 150 mm wafer exposed in under 16 minutes.
- High-Resolution Patterning:
  
  Edge roughness: 60 nm
  
  CD uniformity: 100 nm
  
  40 nm address grid
- Flexible Write Modes:
  
  High-Resolution Mode: 500 nm lines & spaces (375 nm wavelength).
  
  High-Aspect Ratio Mode: Up to 1:20 aspect ratio, ideal for microfluidics and MEMS
- Scalable & Modular:
  
  Exposure area upgradable from 150 x 150 mm² to 200 x 200 mm².
  
  Substrate sizes range from 3” to 6” (up to 8” on request).
- Energy-Efficient & Long-Lasting:
  
  Solid-state laser light sources with 10-20 year lifespan.
  
  Low operational and maintenance costs.
- Seamless Integration in Multi-User Facilities:
  
  Less than 1-hour training required for full user qualification.
  
  Automatic front & backside alignment with real-time autofocus.
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Heidelberg Instruments Heidelberg MLA 300
High-Speed Maskless Lithography for Industrial Volume Production
- High-Throughput Industrial Production: Supports wafers up to 300 x 300 mm² with sub-micron precision.
- 1.5 µm Minimum Feature Size: Offers high resolution and uniformity for demanding applications.
- Dynamic Autofocus & Distortion Correction: Ensures perfect patterning even on warped or corrugated substrates.
- Full Automation & MES Integration: Seamless connection with SECS/GEM and OPC-UA protocols.
- Flexible Write Modes:
  
  Standard Write Mode: 1.5 µm resolution for fine-feature lithography.
  
  High-Throughput Mode: 3 µm resolution for faster exposure and mass production.
- Eliminates Mask-Related Costs: Faster turnaround time and higher design flexibility.
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Heidelberg Instruments Heidelberg NanoFrazor Thermal Scanning Probe Lithography System
High-Resolution, Modular Nanolithography Tool for Advanced Research
- High-Resolution Nanopatterning: 15 nm lateral features, <2 nm vertical resolution.
- Markerless Overlay & Stitching: 25 nm alignment accuracy without markers.
- Damage-Free Lithography: No charged particles or proximity effects, ensuring clean lift-off and etching compatibility.
- Hybrid t-SPL & DLS Lithography: Fast large-area patterning with laser sublimation (DLS) and high-resolution nanoscale writing with t-SPL.
- Parallel Writing with Decapede Module: 10 cantilevers for increased throughput while maintaining high resolution.
- Automated Workflow & Scripting: Python-based automation, real-time imaging, and closed-loop corrections.
- Versatile Process Compatibility: Works with standard pattern transfer methods, including lift-off, etching, and molding.
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Heidelberg Instruments Heidelberg VPG 300 DI Maskless Direct Imaging System
High-Resolution Maskless Direct Imager for R&D & Prototyping
- Maskless Direct Imaging: Write high-resolution microstructures in i-line resists without requiring photomasks.
- Ultra-High-Speed Exposure: 100 x 100 mm² exposure in just 9 minutes.
- Exceptional Resolution & Accuracy:
  
  Minimum feature size: 500 nm
  
  Edge roughness: < 40 nm
  
  CD uniformity: < 60 nm
  
  Alignment accuracy: Topside: 100 nm | Backside VIS/IR: ±1 µm
- Advanced Calibration & Autofocus:
  
  Real-time optical & pneumatic autofocus with 80 µm dynamic compensation.
  
  Integrated metrology functions for positioning, CD uniformity, and edge roughness monitoring.
- Multi-Mode Write System: Choose from two write modes:
  
  High NA Mode: Maximum resolution for ultra-fine microstructures.
  
  Lower NA Mode: Optimized for throughput and depth-of-focus (DOF) critical applications.
- Scalable & Flexible:
  
  Maximum exposure area: 300 x 300 mm².
  
  Compatible with wafers up to 300 mm in size.
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Heidelberg Instruments Heidelberg µMLA Maskless Lithography System
Compact Maskless Lithography System for High-Precision Microstructuring
- High-Resolution Maskless Lithography: No mask required—direct-write exposure ensures efficient and cost-effective fabrication.
- Flexible Exposure Modes:
  
  Raster Scan Mode: Consistent high-speed writing regardless of pattern density.
  
  Vector Scan Mode: Ideal for curved structures, delivering smooth, continuous lines.
- Compact & Small Footprint: 25″ x 33″ x 21″ (640 mm x 840 mm x 530 mm) – fits on a standard lab workbench.
- Fast Exposure Speeds: A 4″ wafer can be exposed in just 90 minutes.
- Advanced Optical Configurations: Min. resolution of 0.6 µm, 1 µm, and 3 µm, with variable resolution options.
- High-Precision Alignment:
  
  Edge roughness: Raster mode: 100 nm, Vector mode: 30 nm
  
  CD uniformity: 200 nm
- Upgradable Exposure Area: Expand from 100 x 100 mm² to 150 x 150 mm².
- Glovebox Integration: Compatible for patterning sensitive materials in controlled environments.