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Nanolithography

Nanolithography is the branch of nanotechnology concerned with the study and application of fabricating nanometer-scale structures, meaning patterns with at least one lateral dimension between 1 and 100 nm. Different approaches can be categorized in serial or parallel, mask or maskless/direct-write, top-down or bottom-up, beam or tip-based, resist-based or resist-less methods. Below is partner we work with in this field:


 Heidelberg

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  • Industry-Leading Control for Quantitative Nanomechanical and Nanotribological Characterization

    • State-of-the-art Digital Signal Processor (DSP) plus Field Programmable Gate Array (FPGA) controller architecture
    • Fully integrated multi-technique control for seamless operation of multiple Hysitron transducers, piezo scanners, dynamic signal generators (nanoDMA® III), and electrical sourcing and measurement (nanoECR®) with maximum signal synchronicity
    • Industry-leading force and displacement noise floors enable characterization to the bottom of the nanoscale:
      • Standard Capacitive Transducer Noise Floors: 0.1nm displacement and 20nN force
      • xProbe™ Transducer Noise Floors: 0.01nm displacement and 1nN force
    • Ultra-fast feedback control loops and data acquisition rates reliably track rapid transient events and deliver high speed testing capabilities
    • Modular controller architecture with up to 24 channels of auxiliary data acquisition and external device control
    • Simultaneous 1.2MHz data sampling rate and 78kHz feedback loop rate on all channels
    • High speed control and acquisition enables 500x faster testing than traditional nanoindentation testing routines, up to 6 measurements per second

     

  • The MLA150 has been specifically designed for easy operation and includes all our know-how on developing maskless lithography systems that we have gathered in the past 30 years. It offers all the capabilities that are required for single layer and multi-layer applications and because the MLA150 exposures are always non-contact it will even overcome some of the limitations of photomask based exposure technologies.

     

  • The MLA100 is the perfect lithography solution for many R&D applications. The optical system is designed to write structures down to 1 μm at a speed of 50 mm²/min directly into photoresist, without the need for a photomask. The elimination of photomasks from the lithographic process will increase the flexibility and significantly shorten the prototyping or manufacturing cycle.

     

  • Setting a new standard for nanoscale IR spectroscopy and imaging

    • One Platform for the highest IR spectral and spatial resolution
    • Two complementary nanoscale IR techniques: s-SNOM; and AFM-IR
    • Multiple nanoscale property mapping modes with full featured AFM
    • “Anasys engineered” for productivity and reliability
  • Lithography systems can accommodate substrates of arbitrary shapes with lateral dimensions of up to 1400 x 1400 mm2

  • Deep UV lithography systems with a 244 nm laser source, which can expose these resists and write isolated structures down to 200 nm and lines and spaces with a period of 500 nm. Other DUV light sources are available on demand.

     

    • Applications for implementation of electronic systems
    • Non-planar surfaces
    • Imaging sensors
    • Artificial vision
    • Integrated micro-optics
    • Substrates up to 200 x 200 mm²
    • Structures down to 0.6 µm
    • Address grid down to 10 nm
    • Multiple write modes
    • Vector and Raster exposure mode
    • Multiple data input formats

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