3D Integration

In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication. The integrated circuit is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a “package”, supports the electrical contacts which connect the device to a circuit board. The semiconductor industry manufactures a huge variety of IC’s that have different packaging requirements. The package type for a particular semiconductor device depends on different attributes including size, power dissipation, field-advanced-packaging-2operating conditions, and last but not least, cost. Advanced packaging technologies include BGA, Flip-Chip, CSP, LGA, PGA and their derivate.

New product designs for smartphones or other mobile devices demand higher integration of features in an innovative form factor. 3D and 2.5D packaging allows significantly smaller chips with higher performance compared to other technologies. 3D stacking of separate chips but also 3 dimensional integrated circuits use Through-Silicon-Via (TSV) as interconnects between the chips, dies or wafer.

For all advanced packaging applications lithography is a key fabrication process. The VPG and DWL series of maskless lithography systems present the standard solution to fabricate high quality photomasks required for advanced packaging applications. For certain critical applications where yield is inacceptable due to lack of resolution and large distortions using standard contact lithography, direct write lithography is currently the only available solution. The VPG series of maskless lithography systems offer high speed, automatic distortion compensation and excellent resolution in order to master these applications.